News

SI-TECH will be offering Proprietary Intellectual Property destruction of patterned wafers commencing August 1st, 2008.

Upon completion of the facilitization and installation of the remaining equipment, we will have the capability for four (4) types of pattern removal and destruction. They are:

1. Sand-blasting - new proprietary equipment has been developed to remove patterns via a sand-blast process which is 10x faster than current sand-blast technology;

2. Chemical stripping - a dual-line chemical washing system in which the wafers are rinsed in either acids or alkali or a combination of both to remove any number of films (metals, oxides, nitrides, poly-layers, etc.);

3. Lapping - a chemical-mechanical process in which the wafer surface is subjected to pressure against an ultra-flat rotating plate until only the silicon surface remains; and

4. Laser - a process in which patterns are obliterated by exposure to short blasts of energy from a laser.

Certificates of Destruction will be provided for each processed lot. Unique to the industry will be the optional provision of a video CD along with the Certificate of Destruction for ultimate assurance the proprietary patterns have been destroyed.

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